SUPERMICRO X13SEI-F - Motherboard - ATX - LGA4677 Socket-E - Intel C741 Chipset - USB 3.2 Gen 1 - 2 x Gigabit LAN - onboard graphics

The Supermicro X13SEI-F supports the 4th Generation Intel Xeon Scalable Processor Scalable Processor Socket E with up to 60 cores and a Thermal Design Power (TDP) of 350 W. Built with the Intel PCH C741 chipset, the X13SEI-F supports 2048 GB of ECC RDIMM/RDIMM 3DS DDR5 memory with speeds of up to 4800 MT/s, M.2 slots, and a Trusted Platform Module (TPM) header. This motherboard is optimized for high-performance, and GPU applications that address the needs of next generation server applications.

• 4th Gen Intel Xeon scalable processors, single socket LGA-4677 (socket E), CPU TDP supports up to 350 W TDP
• Intel C741 chipset
• Up to 2 TB 3DS ECC RDIMM, DDR5-4800 MT/s (1DPC) in 8 DIMM slots
• 2 MCIO (PCIe5.0 x8) connectors for 4 NVMe SSDs
• Dual LAN with 1GbE with Intel I210
• 4 USB 3.2 Gen1 (2 rear, 1 Type-A, 1 via header), 2 USB 2.0 (2 rear)
• Intel C741 controller for 10 SATA3 (6 Gbps) ports

The Supermicro X13SEI-F supports the 4th Generation Intel Xeon Scalable Processor Scalable Processor Socket E with up to 60 cores and a Thermal Design Power (TDP) of 350 W. Built with the Intel PCH C741 chipset, the X13SEI-F supports 2048 GB of ECC RDIMM/RDIMM 3DS DDR5 memory with speeds of up to 4800 MT/s, M.2 slots, and a Trusted Platform Module (TPM) header. This motherboard is optimized for high-performance, and GPU applications that address the needs of next generation server applications.