AORUS X670E XTREME - 1.0 - motherboard - extended ATX - Socket AM5 - AMD X670 Chipset - USB 3.2 Gen 1, USB 3.2 Gen 2, USB-C 3.2 Gen2, USB-C 3.2 Gen 2x2 - Bluetooth, 10 Gigabit LAN, Wi-Fi - onboard graphics (CPU required) - HD Audio (6-channel)
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- Unparalleled performance: direct 18+2+2 Phases Digital VRM solution
- Dual Channel DDR5: 4 SMD DIMMs with AMD EXPO and Intel XMP memory module support
- Next generation storage: 4 PCIe 5.0 x4 M.2 connectors
- Fins-Array III and M.2 Thermal Guard III: to ensure VRM power stability and 25110 PCIe 5.0 M.2 SSD performance
- EZ-Latch plus: SMD PCIe 5.0 x16 Slot and M.2 connectors with quick release and screwless design
- Hi-Fi audio with DTS:X Ultra: ALC1220 CODEC and Rear ESS SABRE Hi-Fi 9118 DAC with Front ESSential USB DAC bundled
- Fast networks: Marvell AQtion 10GbE LAN and Intel Wi-Fi 6E 802.11ax
- Extended connectivity: DP, HDMI, USB-C 10 Gbps, Dual USB-C 20 Gbps and Upcoming GIGABYTE USB4 AIC Support
- Q-Flash plus: update BIOS without installing the CPU, memory and graphics card
- Direct digital VRM design
To ensure maximum Turbo Boost and overclocking performance of AMD's generation CPU, GIGABYTE AORUS series motherboard equip the VRM design ever built with the high quality components. - Design ready for PCIe 5.0
PCIe 5.0 design supports double the bandwidth of PCIe 4.0 and ensures that compatible with cutting-edge SSDs and GPUs released in the next few years to their full capability. - DDR5 EXPO and XMP Overclocking 6666 and beyond
AORUS is offering a tested and proven platform that the memory overclocking capability is able 6666 and beyond. All users need to do for achieving this extreme memory performance boost is to ensure that their DDR5 memory modules are AMD EXPO / Intel XMP capable, the EXPO/XMP function is activated and enabled on their AORUS motherboard. - GIGABYTE active OC tuner
With GIGABYTE's exclusive Active OC Tuner BIOS function, CPU can work with AMD P.B.O. for gaming and other light workload applications with the high CPU boost clock, but when the applications require all CPU cores horsepower, it automatically switches to the Manual OC mode where it can utilize the high frequency for all the CPU cores. - M.2 thermal guard III
M.2 thermal guard III constructed with 9X optimized heat dissipation surface and double-sided M.2 heatsinks to prevent throttling and bottlenecks on high-speed/ large capacity of PCIe 5.0 M.2 SSDs. - Fins-Array III with NanoCarbon coating
Fins-Array III upgraded thermal performance by using extended Irregular fins and louvered stacked-fins design which not only increases surface area by incredible 10X compared to traditional heatsinks but also improves thermal efficiency with better airflow and heat exchange. - 8 mm mega-heatpipe
8 mm mega-heatpipe has 30% wider diameter than traditional 6 mm heatpipe and is able to transfer more heat under same time period. - 8-Layer and 2x copper PCB
2x copper PCBs design effectively lower the component temperature by its high thermal conductivity and low impedance. - Wi-Fi 6E
The wireless solution 802.11ax Wi-Fi 6E with dedicated 6 GHz band, enables gigabit wireless performance, provides smooth video streaming, better gaming experience, few dropped connections and speeds 2.4 Gbps. Moreover, Bluetooth 5 provides 4x range over BT 4 and with faster transmission. - Marvell AQtion 10GbE BASE-T networking
The Marvell AQtion AQC113C is a high-performance, backward compatible with 10GBASE-T/ 5GBASE-T/ 2.5GBASE-T/ 1000BASE-T/ 100BASE-TX Ethernet Controller which is able to provide 10GbE network connectivity, with 10 times faster transfer speeds compared to general 1GbE networking and is perfectly designed for media centers, workstations and gamers. - Connecting the future - USB 3.2 Gen 2x2 Type-C
Featuring the USB 3.2 Gen 2x2 design which is doubled the performance than previous generation of USB 3.2 Gen 2. It works 20 Gbps ultra-fast data transfer while connecting to USB 3.2 compliant peripherals. Through the USB Type-C connector, users can enjoy the flexibility of reversible connection to access and store massive amounts of data rapidly. - Interface
The Easy mode shows important hardware information in one page including CPU clock, memory, storage, fan. - Storage information
Show all kinds of storage information including SATA, PCIE and M.2 interface. - Changelog
List all changes before saving and exiting BIOS. Quickly review overall settings modification. - Intuitive load line curve
Clearly show each loadline calibration setting in an intuitive curve graph. - RGB switch
Turn off all lighting effect on motherboard. - Direct-To-BIOS
Boot into BIOS menu directly without pressing any keyboard button. - Safe mode
Boot into BIOS safe mode to change specific option without losing other BIOS settings. - EZ-Latch plus
With GIGABYTE EZ-Latch plus, you can DIY your PC in no time, quick and easy. - Q-Flash plus
With GIGABYTE Q-Flash plus, you don't need to install the CPU, memory and graphics card nor enter the BIOS menu to flash the BIOS. Just download and save a BIOS file (rename to gigabyte. bin) on the USB flash drive, then press the dedicated Q-Flash plus button and you're good to go!
Ražotājs | GIGABYTE | |
---|---|---|
Produkta līnija | AORUS | |
Procesors / Skaits | 0 | |
Procesors / Maksimālais atbalstītais daudzums | 1 | |
Pamatplate / Form Factor | Extended ATX | |
Pamatplate / Supported RAM Technology | DDR5 SDRAM | |
Pamatplate / Supported RAM Speed | 4400 MHz, 4800 MHz, 5200 MHz, 5600 MHz (O.C.), 6000 MHz (O.C.), 6200 MHz (O.C.), 6400 MHz (O.C.), 6600 MHz (O.C.), 6666 MHz (O.C.), 6800 MHz (O.C.), 7000 MHz (O.C.), 7200 MHz (O.C.), 7600 MHz (O.C.), 7800 MHz (O.C.), 8000 MHz (O.C.) | |
Pamatplate / Chipset tips | AMD X670 | |
Pamatplate / Saderīgie procesori | Ryzen | |
Pamatplate / Modelis | X670E XTREME | |
Networking / Data Link Protocol | 10 Gigabit Ethernet, 2.5 Gigabit Ethernet, 5 Gigabit Ethernet, Bluetooth, Ethernet, Fast Ethernet, Gigabit Ethernet, IEEE 802.11a, IEEE 802.11ac, IEEE 802.11ax (Wi-Fi 6E), IEEE 802.11b, IEEE 802.11g, IEEE 802.11n |
Ražotāja kods | X670E AORUS XTRME |
---|---|
Produkta līnija | AORUS |
Ražotājs | GIGABYTE |
Interfaces / Storage | M.2 socket, Serial ATA-600 (RAID) |
Interfaces / USB / FireWire | USB 3.2 Gen 1, USB 3.2 Gen 2, USB-C 3.2 Gen 2x2, USB-C 3.2 Gen2 |
Pamatplate / Processor Socket | Socket AM5 |
Procesors / Skaits | 0 |
Procesors / Maksimālais atbalstītais daudzums | 1 |
Operatīvā atmiņa (RAM) / Max Supported Size | 192 |
Pamatplate / Form Factor | Extended ATX |
Pamatplate / Supported RAM Technology | DDR5 SDRAM |
Pamatplate / Supported RAM Integrity Check | Non-ECC |
Pamatplate / Supported RAM Speed | 4400 MHz, 4800 MHz, 5200 MHz, 5600 MHz (O.C.), 6000 MHz (O.C.), 6200 MHz (O.C.), 6400 MHz (O.C.), 6600 MHz (O.C.), 6666 MHz (O.C.), 6800 MHz (O.C.), 7000 MHz (O.C.), 7200 MHz (O.C.), 7600 MHz (O.C.), 7800 MHz (O.C.), 8000 MHz (O.C.) |
Pamatplate / Supported RAM (Registered or Buffered) | Unbuffered |
Pamatplate / Chipset tips | AMD X670 |
Pamatplate / Saderīgie procesori | Ryzen |
Pamatplate / Modelis | X670E XTREME |
Audio izvade / Tips | Sound card |
Video izvade / Tips | Graphics adapter (CPU required) |
Networking / Data Link Protocol | 10 Gigabit Ethernet, 2.5 Gigabit Ethernet, 5 Gigabit Ethernet, Bluetooth, Ethernet, Fast Ethernet, Gigabit Ethernet, IEEE 802.11a, IEEE 802.11ac, IEEE 802.11ax (Wi-Fi 6E), IEEE 802.11b, IEEE 802.11g, IEEE 802.11n |
Dimensijas / Platums | 30.5 |
Dimensijas / Dziļums | 26.9 |
Citi / Product Type | Motherboard |
Header / Revision | 1.0 |
Header / Packaged Quantity | 1 |
- AORUS X670E XTREME
- 2 x Wi-Fi aerial
- Software