Gigabyte X570S UD - 1.0 - motherboard - ATX - Socket AM4 - AMD X570 Chipset - USB 3.2 Gen 1, USB-C Gen2, USB 3.2 Gen 2 - 2.5 Gigabit LAN - onboard graphics (CPU required) - HD Audio (8-channel)
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To unleash the full potential of the AMD Ryzen 5000 series processors, the motherboard requires exceptional CPU power, memory and IO design. With high-quality components and GIGABYTE R&D design capability, X570S UD is a true beast among motherboards.
- Dual-channel ECC/ Non-ECC unbuffered DDR4, 4 DIMMs
- Twin 12+2 phases digital VRM solution with 50A DrMOS
- Fully covered thermal design with high coverage MOSFET heatsinks
- Triple ultra-fast NVMe PCIe 4.0/3.0 x4 M.2 with Thermal Guard
- Fast 2.5GbE LAN with bandwidth management
- Rear and front USB3.2 Type-C for fast and versatile connections
- High quality audio capacitors and Audio Noise Guard for ultimate audio quality
- Smart Fan 6 features multiple temperature sensors, hybrid fan headers with Fan Stop
- RGB Fusion 2.0 with multi-zone addressable LED light show design, support addressable LED and RGB LED strips
- Twin power design
GIGABYTE X570S motherboards are equipped with an excellent power solution to release the full potential of the AMD Ryzen CPUs. The VRM power design includes MOSFETs which Vcore accompanied by digital PWM, great chokes and high-quality capacitors to offer extraordinary stability and precision to the high performance CPU. In addition, six-layered PCB and comprehensive thermal solution allows enthusiasts to enjoy the extreme overclocking performance without compromise. - Memory layout - daisy-chain design
With the optimized daisy-chain routing, GIGABYTE X570S motherboards provide a proven speed of up to DDR4-5100 MHz with high density memory modules. Optimized daisy-chained routing eliminates the stub effect, pushes the one DIMM per channel in dual channel interleaving mode to hit higher memory frequencies, and provides professional gamers a denser and faster system memory experience. - 2x large surface
The motherboard provides increased surface area up to 2x larger compared to traditional heatsinks. It improves heat dissipation from the MOSFETs. - Real one-piece build
TMOS is a true single piece heatsink. Its one-piece design and larger surface drastically improve the cooling performance against competitors' multi-piece design. - Multi-cut design
TMOS features several channels and inlets on the heatsink. This design allows for the air flow to go through which leads to a great improvement of the heat transfer performance. - GIGABYTE ultra-efficient M.2 Thermal Guard
With durability in mind, GIGABYTE provides a thermal solution for M.2 SSD devices. The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue. - Smart Fan 6
Smart Fan 6 contains several unique cooling features that ensure gaming PC maintain its performance while staying cool and quiet. Multiple fan headers can support PWM/DC fan and pump, and users can easily define each fan curve based on different temperature sensors across the board via intuitive user interface. - 2x faster than ever
Adoption of 2.5G LAN provides up to 2.5 GbE network connectivity, with at least 2 times faster transfer speeds compared to general 1 GbE networking, perfectly designed for gamers with ultimate online gaming experience. - Rear and front USB3.2 Type-C support
The device includes both front and rear USB Type-C connectors with fast USB 3.2 Gen 2 for transmission speeds of up to 10 Gbps. With twice the bandwidth compared to its previous generation as well as backwards compatibility with USB 2.0 and USB 3.2 Gen 1, the much improved USB 3.2 Gen 2 protocol is available over the reversible USB Type-C and the traditional USB Type-A connector for better compatibility over a wider range of devices. - HDMI 2.1 for 4K / 60p / 21:9 / HDCP 2.3 support
HDMI 2.1 is backwards compatible with HDMI 2.0/ 1.4 and offering 48 Gb/s of bandwidth - twice times more than previous generation. This unlocks the potential for users to transfer multiple video streams, as well as a native cinematic 21:9 ratio (which most movies are shot in), Full HDR and HDCP 2.3 support, to offer an incredible visual experience for viewers. - Excellent audio capacitors
GIGABYTE motherboards use excellent audio capacitors. These high-quality capacitors help deliver high-resolution and high-fidelity audio to provide the most realistic sound effects for gamers. - Audio Noise Guard
GIGABYTE motherboards feature an audio noise guard that essentially separates the board's sensitive analog audio components from potential noise pollution at the PCB level. - RGB Fusion 2.0
X570S UD features RGB Fusion 2.0 to offer lighting effected solutions and adjusted settings with outstanding aesthetics, and able to let enthusiasts building a stylish and unique gaming PC. - Ultra Durable PCIe Armor
The innovative one-piece stainless steel shielding design from GIGABYTE reinforces the PCIe connectors to provide the extra strength required to support heavy graphics cards. - Solid pin power connectors
X570S motherboards feature solid plated ATX 12V 8-pin power connectors to offer a stable power supply during CPU overloading.
To unleash the full potential of the AMD Ryzen 5000 series processors, the motherboard requires exceptional CPU power, memory and IO design. With high-quality components and GIGABYTE R&D design capability, X570S UD is a true beast among motherboards.
Ražotājs | GIGABYTE | |
---|---|---|
Produkta līnija | Gigabyte | |
Procesors / Skaits | 0 | |
Procesors / Maksimālais atbalstītais daudzums | 1 | |
Pamatplate / Form Factor | ATX | |
Pamatplate / Supported RAM Technology | DDR4 SDRAM | |
Pamatplate / Supported RAM Speed | 2133 MHz, 2400 MHz, 2667 MHz, 2933 MHz, 3200 MHz, 3300 MHz (O.C.), 3333 MHz (O.C.), 3400 MHz (O.C.), 3466 MHz (O.C.), 3600 MHz (O.C.), 3733 MHz (O.C.), 3800 MHz (O.C.), 3866 MHz (O.C.), 4000 MHz (O.C.), 4133 MHz (O.C.), 4266 MHz (O.C.), 4300 MHz (O.C.), 4400 MHz (O.C.), 4866 MHz (O.C.), 5000 MHz (O.C.), 5100 MHz (O.C.) | |
Pamatplate / Chipset tips | AMD X570 | |
Pamatplate / Saderīgie procesori | Ryzen | |
Pamatplate / Modelis | X570S UD | |
Networking / Data Link Protocol | 2.5 Gigabit Ethernet, Fast Ethernet, Gigabit Ethernet |
Ražotāja kods | 0889523028902 |
---|---|
Produkta līnija | Gigabyte |
Ražotājs | GIGABYTE |
Interfaces / Storage | M.2 socket, Serial ATA-600 (RAID) |
Interfaces / USB / FireWire | USB 3.2 Gen 1, USB 3.2 Gen 2, USB-C Gen2 |
Pamatplate / Processor Socket | Socket AM4 |
Procesors / Skaits | 0 |
Procesors / Maksimālais atbalstītais daudzums | 1 |
Operatīvā atmiņa (RAM) / Max Supported Size | 128 |
Pamatplate / Form Factor | ATX |
Pamatplate / Supported RAM Technology | DDR4 SDRAM |
Pamatplate / Supported RAM Integrity Check | ECC, Non-ECC |
Pamatplate / Supported RAM Speed | 2133 MHz, 2400 MHz, 2667 MHz, 2933 MHz, 3200 MHz, 3300 MHz (O.C.), 3333 MHz (O.C.), 3400 MHz (O.C.), 3466 MHz (O.C.), 3600 MHz (O.C.), 3733 MHz (O.C.), 3800 MHz (O.C.), 3866 MHz (O.C.), 4000 MHz (O.C.), 4133 MHz (O.C.), 4266 MHz (O.C.), 4300 MHz (O.C.), 4400 MHz (O.C.), 4866 MHz (O.C.), 5000 MHz (O.C.), 5100 MHz (O.C.) |
Pamatplate / Supported RAM (Registered or Buffered) | Unbuffered |
Pamatplate / Chipset tips | AMD X570 |
Pamatplate / Saderīgie procesori | Ryzen |
Pamatplate / Modelis | X570S UD |
Audio izvade / Tips | Sound card |
Video izvade / Tips | Graphics adapter (CPU required) |
Networking / Data Link Protocol | 2.5 Gigabit Ethernet, Fast Ethernet, Gigabit Ethernet |
Dimensijas / Platums | 30.5 |
Dimensijas / Dziļums | 24.4 |
Citi / Product Type | Motherboard |
Header / Revision | 1.0 |
Header / Packaged Quantity | 1 |